-15%
AMD, CPU, Ryzen 9
AMD Ryzen 9 7950X 3D 16 cores 32 Threads AM5 Desktop Processor 100-100000908WOF
- 16 Cores & 32 Threads, 144 MB Cache
- Base Clock: 4.2 GHz, Max Boost Clock: up to 5.7 GHz
- Memory Support: DDR5 5200MHz, Memory Channels: 2, TDP: 120W, PCI Express Generation : PCIe Gen 5
- Compatible with Motherboards based on 600 Series Chipset, Socket AM5
- On Chip Graphic Card
₹58,695.00 ₹68,999.00
The Ultimate Processor for Gaming, with AMD 3D V-Cache™ Technology for Even More Game Performance
The 16-core processor that can do it all with incredible performance from AMD for the most demanding gamers and creators. Plus, enjoy the benefits of next-gen AMD 3D V-Cache™ technology for low latency and even more game performance.
AMD Ryzen 9 7950X 3D 16 cores 32 Threads AM5 Desktop Processor 100-100000908WOF
| Weight | 1 kg |
|---|---|
| brands | AMD |
General Specifications
| Platform | Desktop |
|---|---|
| Market Segment | Enthusiast Desktop |
| Product Family | AMD Ryzen™ Processors |
| Product Line | AMD Ryzen™ 9 Processors |
| AMD PRO Technologies | No |
| Consumer Use | Yes |
| Regional Availability | Global |
| Former Codename | “Raphael AM5” |
| Architecture | “Zen 4” |
| # of CPU Cores | 16 |
| Multithreading (SMT) | Yes |
| # of Threads | 32 |
| Max. Boost Clock | Up to 5.7GHz |
| Base Clock | 4.2GHz |
| L1 Cache | 1MB |
| L2 Cache | 16MB |
| L3 Cache | 128MB |
| Default TDP | 120W |
| Processor Technology for CPU Cores | TSMC 5nm FinFET |
| Processor Technology for I/O Die | TSMC 6nm FinFET |
| CPU Compute Die (CCD) Size | 71mm² |
| I/O Die (IOD) Size | 122mm² |
| Package Die Count | 3 |
| AMD EXPO™ Memory Overclocking Technology | Yes |
| Precision Boost Overdrive | Yes |
| Curve Optimizer Voltage Offsets | Yes |
| AMD Ryzen™ Master Support | Yes |
| CPU Socket | AM5 |
| Supporting Chipsets | A620 X670E X670 B650E B650 |
| CPU Boost Technology | Precision Boost 2 |
| Instruction Set | x86-64 |
| Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Thermal Solution (PIB) | Not Included |
| Recommended Cooler | Liquid cooler recommended for optimal performance |
| Max. Operating Temperature (Tjmax) | 89°C |
| Launch Date | 2/28/2023 |
| *OS Support | Windows 11 – 64-Bit Edition Windows 10 – 64-Bit Edition RHEL x86 64-Bit Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer. |
Connectivity
| USB Type-C® Support | Yes |
|---|---|
| Native USB 3.2 Gen 2 (10Gbps) Ports | 4 |
| Native USB 3.2 Gen 1 (5Gbps) Ports | 0 |
| Native USB 2.0 (480Mbps) Ports | 1 |
| Native SATA Ports | 0 |
| PCI Express® Version | PCIe® 5.0 |
| Native PCIe® Lanes (Total/Usable) | 28 / 24 |
| Additional Usable PCIe Lanes from Motherboard | AMD X670E: 12x Gen4 AMD X670: 12x Gen4 AMD B650E: 8x Gen4 AMD B650: 8x Gen4 |
| NVMe Support | Boot, RAID0, RAID1, RAID10 |
| System Memory Type | DDR5 |
| Memory Channels | 2 |
| Max. Memory | 128GB |
| System Memory Subtype | UDIMM |
| Max Memory Speed | 2x1R: DDR5-5200 2x2R: DDR5-5200 4x1R: DDR5-3600 4x2R: DDR5-3600 |
| ECC Support | Yes (Requires mobo support) |
Graphics Capabilities
| Integrated Graphics | Yes |
|---|---|
| Graphics Model | AMD Radeon™ Graphics |
| Graphics Core Count | 2 |
| Graphics Frequency | 2200 MHz |
| USB Type-C® DisplayPort™ Alternate Mode | Yes |
Product IDs
| Product ID Boxed | 100-100000908WOF |
|---|---|
| Product ID Tray | 100-000000908 |
Key Features
| Supported Technologies | AMD EXPO™ Technology AMD Ryzen™ Technologies |
|---|
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